CASPIAN SALES FORCE


Where customers matter


  • HOME
  • ABOUT US
  • WHY CHOOSE US
  • PRODUCTS
    • Non-contact 3D Measurement Systems
    • Environmental Test Equipment
  • SERVICES
  • CONTACT US

PRODUCTS





Caspian Sales Force has recently partnered with cyber TECHNOLOGIES, a German company based in Munich, Germany, to be their sales representative from SF Bay to the Upper Northwest. Cyber TECHNOLOGIES has been developing and manufacturing non-contact metrology systems for over 20 years. We offer systems for R&D, small scale production, and high volume production.



CT 100



CT Series: High-end 3D surface metrology systems at the cutting edge of technology





The CT 100 is a compact, high resolution non-contact profilometer. The main components of the system are a white light sensor and a x-, y-motion system on a granite platform. The chromatic white light sensors combine high accuracy and high measurement speed. The sensors are available with a resolution down to 3 nm and measurement range up to 12 mm. The system can scan a maximum area of 150 mm x 150 mm. The unique cyberTECHNOLOGIES Software offers sophisticated surface metrology analysis and automated measurement routines.


more

CT 350S



CT Series: High-end 3D surface metrology systems at the cutting edge of technology





The CT 350S is a non-contact profilometer with a 350 mm x-, y-scanning stage and a closed loop 200 mm z-axis. All 3 axis use air bearings and magnetic linear motors. The system is based on a massive granite construction with a vibration isolated floor stand. The xy motion system offers exceptional performance with an error of less than 100 nm. During the scanning process the z-axis can follow the shape of the part. The height reading is a combination of the calibrated z encoder signal and the sensor height. This allows the system to achieve a very high resolution over the entire z-axis range of 200 mm.


more

applications:





  • Height

  • Flatness
  • Warpage
  • Waviness
  • Roughness
  • Coplanarity
  • Pin Height
  • Pin Diameter
  • Bump Height
  • Bump Volume
  • Via Diameter
  • Via Depth
  • Fillet Height
  • Laser Marking
  • Die Tilt & Rotation
  • Total Thickness/TTV
  • Film Thickness
  • X/Y Dimension
  • X/Y Location
  • Wirebond
  • 2D Vision